Laser technology from Jenoptik for the separation of microchips complements the 3D-Micromac’s product portfolio. This acquisition enables the company to reinforce its know-how as a system provider for laser systems in the semiconductor industry.
Jenoptik and 3D-Micromac AG have announced the technology transfer of thermal laser separation (TLS-Dicing®) as part of a so-called asset deal. As of 1 January 2014, know-how, patents and results of the development from Jenoptik’s Laser & Materials Processing Division are transferred to 3D-Micromac AG in Chemnitz.
Immediate commercialisation of the technology by 3D-Micromac will be possible with the transfer. With the acquisition, the company reinforces its know-how as a system provider for laser systems in the semiconductor industry and advances the expansion of its product portfolio in this area. Jenoptik’s Laser & Materials Processing Division will continue in the future to focus on the 3D processing of plastics and metals, e.g. in the automobile industry.
“With TLS-Dicing® we obtain a technology that will perfectly complement our product portfolio in the semiconductor industry and enable us to expand our market position. In addition to component processing at wafer level we can now also offer innovative solutions for separating of microchips,” according to Tino Petsch, CEO of 3D-Micromac AG. “In the coming months, we will continue to further develop the process in cooperation with the Fraunhofer IISB and implement it in industry-ready machine technology,” Petsch continued.
“Jenoptik’s Laser & Materials Processing Division has increasingly focused on its core markets and sharpened its portfolio in recent months,” said Dietmar Wagner, general manager of JENOPTIK Automatisierungstechnik GmbH, following the signing of the contract. “We are pleased that with 3D-Micromac AG we have found a buyer for TLS-Dicing®, which wants to successfully commercialize the technology in the shortest possible time,” said Wagner further.