Page 127 - Glass-Technology International no. 5-2018

tronic devices such as
ICT AND power semiconductors.
SEMICONDUCTORS Material design can be op-
The information commu- timized for each applica-
nication field is constantly tion. Processed products
undergoing rapid market also include green sheets,
changes and technologi- glass paste, and tablets.
cal innovation. Glass with
excellent properties, such Glass for optical
as transmittance, herme- communication
ticity, and electrical insu- By utilizing material devel-
lation, plays an important opment, precision machin-
role in optical and elec- ing, and assembly tech-
tronic devices that sup- nologies required for glass
port a highly information- manufacturing, NEG pro-
oriented society. vides various products that
connect high-speed optical
Glass substrate/cover glass communication networks.
NEG offers a variety of Products include micro
glass substrate products prisms, micro lens arrays,
which have optical and/ micro balls, aspherical lens-
or electrical functions, es, and micro capillaries.
mechanical strength, and
chemical durability. Ap- Glass frit for laser-sealing of
plications include cover ceramic package
glass for image sensors and NEG developed the world’s
infrared absorbing filters first glass frits for laser-
used in sophisticated cam- sealing of ceramic pack-
eras, and glass for support- ages that are an optimal
ing semiconductor wafers solution to sealing glass
filters, and band pass filters Lamion™. This hybrid ma- used in the semiconductor lids and ceramic cavities.
are important parts of in- terial has both the abrasion manufacturing process. NEG glass frit for laser-
vehicle sensors. resistance and gas barrier sealing of ceramic package
properties of glass and the Functional powder glass/glass enables local laser heat-
Lamion™, ultra-thin glass light weight and shock re- paste ing, which reduces thermal
laminated on resin sistance of resin. It is being These are widely used to damage and contributes
G-Leaf™ is laminated used in train station plat- form insulating films, coat to increased reliability and
onto one or both sides of a form doors and covers for electronic components, extended lifetime of elec-
resin plate or film to make digital signage. and hermetically seal elec- tronic devices.

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